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    <title>Advanced-Packaging on KAD</title>
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      <title>SK Hynix Targets 20&#43; Layer HBM5 Stacks With Hybrid Bonding</title>
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      <pubDate>Sun, 13 Sep 2026 12:10:05 +0800</pubDate>
      
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      <title>Google&#39;s 10th-Gen TPU May Add AMD CPU Cores for AI Workloads</title>
      <link>https://www.kad8.com/ai/googles-10th-gen-tpu-may-add-amd-cpu-cores-for-ai-workloads/</link>
      <pubDate>Mon, 17 Aug 2026 21:00:04 +0800</pubDate>
      
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      <title>TSMC vs Intel vs Samsung vs GF: The CPO Roadmap Race</title>
      <link>https://www.kad8.com/hardware/tmc-vs-intel-vs-samsung-vs-gf-the-cpo-roadmap-race/</link>
      <pubDate>Sat, 15 Aug 2026 15:28:10 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/tmc-vs-intel-vs-samsung-vs-gf-the-cpo-roadmap-race/</guid>
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      <title>Google&#39;s 9th-Gen TPU May Adopt Intel&#39;s EMIB-T Packaging</title>
      <link>https://www.kad8.com/ai/googles-9th-gen-tpu-may-adopt-intels-emib-t-packaging/</link>
      <pubDate>Sat, 08 Aug 2026 16:03:31 +0800</pubDate>
      
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      <title>Terafab: SpaceX and Tesla Plan a 100M-Sq-Ft Chip Fab</title>
      <link>https://www.kad8.com/news/terafab-spacex-and-tesla-plan-a-100m-sq-ft-chip-fab/</link>
      <pubDate>Fri, 07 Aug 2026 18:16:49 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/terafab-spacex-and-tesla-plan-a-100m-sq-ft-chip-fab/</guid>
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      <title>Intel EMIB-T Challenges CoWoS with Up to 50% Lower Packaging Costs</title>
      <link>https://www.kad8.com/hardware/intel-emib-t-challenges-cowos-with-up-to-50-percent-lower-packaging-costs/</link>
      <pubDate>Wed, 05 Aug 2026 00:02:03 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-emib-t-challenges-cowos-with-up-to-50-percent-lower-packaging-costs/</guid>
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      <title>Intel Foundry May Win NVIDIA Feynman Wafer and Packaging Orders</title>
      <link>https://www.kad8.com/news/intel-foundry-may-win-nvidia-feynman-wafer-and-packaging-orders/</link>
      <pubDate>Sat, 25 Jul 2026 19:33:47 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/intel-foundry-may-win-nvidia-feynman-wafer-and-packaging-orders/</guid>
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      <title>Samsung Unveils HBM4E and Full-Stack AI Solutions at GTC 2026</title>
      <link>https://www.kad8.com/ai/samsung-unveils-hbm4e--and-full-stack-ai-solutions-at-gtc-2026/</link>
      <pubDate>Mon, 20 Jul 2026 16:35:34 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/samsung-unveils-hbm4e--and-full-stack-ai-solutions-at-gtc-2026/</guid>
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    <item>
      <title>Intel Foundry Wins AMD, NVIDIA and OpenAI Orders as EMIB Yield Hits 98%</title>
      <link>https://www.kad8.com/hardware/intel-foundry-wins-amd-nvidia-and-openai-orders-as-emib-yield-hits-98-percent/</link>
      <pubDate>Wed, 15 Jul 2026 10:28:59 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-foundry-wins-amd-nvidia-and-openai-orders-as-emib-yield-hits-98-percent/</guid>
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      <title>JEDEC SPHBM4 Standard Cuts HBM Packaging Costs Without CoWoS</title>
      <link>https://www.kad8.com/news/jedec-sphbm4-standard-cuts-hbm-packaging-costs-without-cowos/</link>
      <pubDate>Fri, 10 Jul 2026 18:09:17 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/jedec-sphbm4-standard-cuts-hbm-packaging-costs-without-cowos/</guid>
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    <item>
      <title>Huawei Tau Scaling V2 Explained: Is the Semiconductor Industry Entering the Tau Era?</title>
      <link>https://www.kad8.com/hardware/huawei-tau-scaling-v2-explained-is-the-semiconductor-industry-entering-the-tau-era/</link>
      <pubDate>Tue, 07 Jul 2026 19:49:41 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/huawei-tau-scaling-v2-explained-is-the-semiconductor-industry-entering-the-tau-era/</guid>
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    <item>
      <title>NVIDIA Reportedly Revises Rubin Ultra AI GPU to a Dual-Die Design</title>
      <link>https://www.kad8.com/ai/nvidia-reportedly-revises-rubin-ultra-ai-gpu-to-a-dual-die-design/</link>
      <pubDate>Thu, 02 Jul 2026 01:14:35 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/nvidia-reportedly-revises-rubin-ultra-ai-gpu-to-a-dual-die-design/</guid>
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      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/nvidia-reportedly-revises-rubin-ultra-ai-gpu-to-a-dual-die-design/featured-Nvidia-Revise-Rubin-Ultra-AI-GPU.jpeg" />
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    <item>
      <title>NVIDIA Rubin Ultra Reportedly Shifts to Dual-Die Design for 2027</title>
      <link>https://www.kad8.com/news/nvidia-rubin-ultra-reportedly-shifts-to-dual-die-design-for-2027/</link>
      <pubDate>Mon, 29 Jun 2026 01:26:50 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/nvidia-rubin-ultra-reportedly-shifts-to-dual-die-design-for-2027/</guid>
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    <item>
      <title>TSMC and Intel Accelerate Advanced Packaging as Market Tops $8.1 Billion</title>
      <link>https://www.kad8.com/hardware/tsmc-and-intel-accelerate-advanced-packaging-as-market-tops-8.1-billion/</link>
      <pubDate>Wed, 24 Jun 2026 18:57:39 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/tsmc-and-intel-accelerate-advanced-packaging-as-market-tops-8.1-billion/</guid>
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    <item>
      <title>Intel CEO Lip-Bu Tan’s Vision for AI, Foundry Growth, and Next-Gen Manufacturing</title>
      <link>https://www.kad8.com/news/intel-ceo-lip-bu-tans-vision-for-ai-foundry-growth-and-next-gen-manufacturing/</link>
      <pubDate>Mon, 22 Jun 2026 18:16:52 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/intel-ceo-lip-bu-tans-vision-for-ai-foundry-growth-and-next-gen-manufacturing/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/news/intel-ceo-lip-bu-tans-vision-for-ai-foundry-growth-and-next-gen-manufacturing/featured-Intel_CEO_outlines_AI_turnaround_strategy.jpeg" />
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    <item>
      <title>Intel Spins Off Advanced Packaging Unit Under Seok-Hee Lee</title>
      <link>https://www.kad8.com/news/intel-spins-off-advanced-packaging-unit-under-seok-hee-lee/</link>
      <pubDate>Sun, 21 Jun 2026 11:35:41 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/intel-spins-off-advanced-packaging-unit-under-seok-hee-lee/</guid>
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      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/news/intel-spins-off-advanced-packaging-unit-under-seok-hee-lee/featured-Intel_appoints_Lee_lead_business.jpeg" />
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    <item>
      <title>Why Marvell Could Be the Biggest Winner in the CPO Era</title>
      <link>https://www.kad8.com/ai/why-marvell-could-be-the-biggest-winner-in-the-cpo-era/</link>
      <pubDate>Thu, 11 Jun 2026 22:47:07 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/why-marvell-could-be-the-biggest-winner-in-the-cpo-era/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/why-marvell-could-be-the-biggest-winner-in-the-cpo-era/featured-Marvell_Co-Packaged_Optics_revolution.jpeg" />
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    <item>
      <title>Intel Reportedly Wins 3 Million AI Chip Order as NVIDIA Evaluates Packaging Tech</title>
      <link>https://www.kad8.com/hardware/intel-reportedly-wins-3-million-ai-chip-order-as-nvidia-evaluates-packaging-tech/</link>
      <pubDate>Mon, 08 Jun 2026 19:55:00 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-reportedly-wins-3-million-ai-chip-order-as-nvidia-evaluates-packaging-tech/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/intel-reportedly-wins-3-million-ai-chip-order-as-nvidia-evaluates-packaging-tech/featured-Intel_Google_AI_chip_order.jpeg" />
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      <title>IMEC Roadmap: Sub-1nm Chips Expected Around 2034</title>
      <link>https://www.kad8.com/hardware/imec-roadmap-sub-1nm-chips-expected-around-2034/</link>
      <pubDate>Thu, 28 May 2026 23:14:40 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/imec-roadmap-sub-1nm-chips-expected-around-2034/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/imec-roadmap-sub-1nm-chips-expected-around-2034/featured-IMEC_Roadmap.png" />
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      <title>AMD’s $10 Billion Taiwan Bet Could Reshape AI Computing</title>
      <link>https://www.kad8.com/ai/amds-10-billion-taiwan-bet-could-reshape-ai-computing/</link>
      <pubDate>Sat, 23 May 2026 10:32:02 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/amds-10-billion-taiwan-bet-could-reshape-ai-computing/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/amds-10-billion-taiwan-bet-could-reshape-ai-computing/featured-AMD_investment_challenges_Nvidia.jpeg" />
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      <title>TSMC Maintains Lead Over Intel in Advanced AI Chip Packaging</title>
      <link>https://www.kad8.com/ai/tsmc-maintains-lead-over-intel-in-advanced-ai-chip-packaging/</link>
      <pubDate>Sat, 16 May 2026 10:28:52 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/tsmc-maintains-lead-over-intel-in-advanced-ai-chip-packaging/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/tsmc-maintains-lead-over-intel-in-advanced-ai-chip-packaging/featured-TSMC_Maintains_Lead_Over_Intel.png" />
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      <title>Intel and NVIDIA Deepen Alliance with New AI and GPU Plans</title>
      <link>https://www.kad8.com/hardware/intel-and-nvidia-deepen-alliance-with-new-ai-and-gpu-plans/</link>
      <pubDate>Mon, 11 May 2026 23:10:41 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-and-nvidia-deepen-alliance-with-new-ai-and-gpu-plans/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/intel-and-nvidia-deepen-alliance-with-new-ai-and-gpu-plans/featured-Intel-and-NVIDIA-Deepen-Alliance.png" />
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      <title>Intel and NVIDIA Expand Partnership for AI and Client Platforms</title>
      <link>https://www.kad8.com/news/intel-and-nvidia-expand-partnership-for-ai-and-client-platforms/</link>
      <pubDate>Mon, 11 May 2026 22:28:54 +0800</pubDate>
      
      <guid>https://www.kad8.com/news/intel-and-nvidia-expand-partnership-for-ai-and-client-platforms/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/news/intel-and-nvidia-expand-partnership-for-ai-and-client-platforms/featured-Intel-and-Nvidia-Expand-Partnership.png" />
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      <title>Google TPU Shift to Intel: EMIB-T Yield and Cost Analysis</title>
      <link>https://www.kad8.com/ai/google-tpu-shift-to-intel-emib-t-yield-and-cost-analysis/</link>
      <pubDate>Tue, 05 May 2026 09:44:03 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/google-tpu-shift-to-intel-emib-t-yield-and-cost-analysis/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/google-tpu-shift-to-intel-emib-t-yield-and-cost-analysis/featured-Google_adopts_Intel_EMIB-T.jpeg" />
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      <title>Sehat Sutardja: Marvell Co-Founder and Chiplet Pioneer</title>
      <link>https://www.kad8.com/hardware/sehat-sutardja-marvell-co-founder-and-chiplet-pioneer/</link>
      <pubDate>Sat, 02 May 2026 10:37:09 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/sehat-sutardja-marvell-co-founder-and-chiplet-pioneer/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/sehat-sutardja-marvell-co-founder-and-chiplet-pioneer/featured-Semiconductor_technology_journey.jpeg" />
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      <title>Samsung iCube vs CoWoS: Advanced Packaging in Nvidia’s AI Supply Chain</title>
      <link>https://www.kad8.com/ai/samsung-icube-vs-cowos-advanced-packaging-in-nvidias-ai-supply-chain/</link>
      <pubDate>Mon, 20 Apr 2026 23:38:33 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/samsung-icube-vs-cowos-advanced-packaging-in-nvidias-ai-supply-chain/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/ai/samsung-icube-vs-cowos-advanced-packaging-in-nvidias-ai-supply-chain/featured-Samsung_iCube_challenges.jpeg" />
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      <title>Tesla and Intel 18A: Inside the TeraFab AI Chip Strategy</title>
      <link>https://www.kad8.com/hardware/tesla-and-intel-18a-inside-the-terafab-ai-chip-strategy/</link>
      <pubDate>Wed, 08 Apr 2026 21:08:21 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/tesla-and-intel-18a-inside-the-terafab-ai-chip-strategy/</guid>
      <description></description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/tesla-and-intel-18a-inside-the-terafab-ai-chip-strategy/featured-Tesla_partners_Intel.jpeg" />
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      <title>Intel EMIB Packaging: A Key Alternative in the AI Chip Era</title>
      <link>https://www.kad8.com/ai/intel-emib-packaging-a-key-alternative-in-the-ai-chip-era/</link>
      <pubDate>Sun, 08 Mar 2026 09:53:58 +0800</pubDate>
      
      <guid>https://www.kad8.com/ai/intel-emib-packaging-a-key-alternative-in-the-ai-chip-era/</guid>
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      <title>Broadcom Ignites the 2nm AI Chip Race</title>
      <link>https://www.kad8.com/hardware/broadcom-ignites-the-2nm-ai-chip-race/</link>
      <pubDate>Mon, 02 Mar 2026 18:21:10 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/broadcom-ignites-the-2nm-ai-chip-race/</guid>
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      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/broadcom-ignites-the-2nm-ai-chip-race/featured-Broadcom-2nm-Custom-AI-SOC.jpeg" />
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      <title>Intel EMIB vs TSMC 2.5D: The Packaging Battle Heats Up</title>
      <link>https://www.kad8.com/hardware/intel-emib-vs-tsmc-2.5d-the-packaging-battle-heats-up/</link>
      <pubDate>Sun, 18 Jan 2026 00:38:10 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-emib-vs-tsmc-2.5d-the-packaging-battle-heats-up/</guid>
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      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/intel-emib-vs-tsmc-2.5d-the-packaging-battle-heats-up/featured-Intel-EMIB.png" />
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      <title>Intel Reveals Advanced Packaging with 16 Compute Tiles and 24 HBM Sites</title>
      <link>https://www.kad8.com/hardware/intel-reveals-advanced-packaging-with-16-compute-tiles-and-24-hbm-sites/</link>
      <pubDate>Wed, 24 Dec 2025 22:04:25 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/intel-reveals-advanced-packaging-with-16-compute-tiles-and-24-hbm-sites/</guid>
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      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/intel-reveals-advanced-packaging-with-16-compute-tiles-and-24-hbm-sites/featured-Intel-Foundry.png" />
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      <title>Intel May Secure Google TPU Packaging Orders</title>
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      <pubDate>Thu, 27 Nov 2025 01:33:43 +0800</pubDate>
      
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