Storages
2026
HBF Reshapes AI Inference: High Bandwidth Flash Explained
·2449 words·12 mins
HBF
High Bandwidth Flash
NAND Flash
AI Inference
HBM
Memory Technology
SK Hynix
Semiconductor
Montage Technology CXL 3.2 MXC Enters Samsung and SK Hynix
·2564 words·13 mins
Montage Technology
CXL
CXL 3.2
MXC
PCIe 6.x
PCIe Retimer
Memory Pooling
AI Infrastructure
Semiconductor
SK hynix and SanDisk Launch Open HBF Standard for AI Memory
·1709 words·9 mins
SK Hynix
SanDisk
HBF
High Bandwidth Flash
NAND
HBM
AI Infrastructure
UCIe
OCP
FMS 2026
3D NAND's Three Key Technologies Beyond 300 Layers
·1876 words·9 mins
3D NAND
NAND Flash
Semiconductor
Memory
QLC
Wafer Bonding
Molybdenum
Enterprise SSD
YMTC
CXMT LPDDR6 Mass Production: A New Milestone for Mobile DRAM
·1741 words·9 mins
CXMT
LPDDR6
DRAM
Mobile Memory
Semiconductors
Xiaomi
On-Device AI
Memory Technology
Samsung 900-Layer NAND: 450-Layer Wafer Bonding Explained
·1814 words·9 mins
Samsung
NAND Flash
V-NAND
3D NAND
Cell Multi-Bonding
Hybrid Bonding
Enterprise SSD
AI Storage
Semiconductor
YMTC Targets #1 NAND Market Share by 2027
·2108 words·10 mins
YMTC
NAND Flash
3D NAND
Semiconductors
Memory
Xtacking
China Semiconductor
Samsung
SK Hynix
KIOXIA PCIe 6.0 SSDs Hit 10M IOPS for AI Storage
·2335 words·11 mins
KIOXIA
PCIe 6.0
NVMe SSD
AI Storage
Enterprise SSD
Flash Memory
Data Center
NAND
AI Infrastructure
MRDIMM Explained: DDR5 Multiplexed Rank Memory for Servers
·1668 words·8 mins
MRDIMM
DDR5
Server Memory
Memory Bandwidth
Intel Xeon 6
AI Infrastructure
HPC
Data Centers
Samsung Targets 1,000-Layer NAND and 32TB M.2 SSDs
·1459 words·7 mins
Samsung
NAND
V-NAND
SSD
Storage
Flash Memory
3D NAND
Semiconductors
AI Infrastructure