Huawei Ascend Overtakes Nvidia in China's AI Chip Market 6 October 2026·1420 words·7 mins Huawei NVIDIA Ascend AI Chips China AI Infrastructure Semiconductors CUDA
Samsung HBM4 Production Could Double in 2027 6 October 2026·1170 words·6 mins Samsung HBM4 HBM4E AI Memory DRAM Semiconductors NVIDIA HBM
Server CPU Lead Times Hit 25–30 Weeks as Agentic AI Grows 3 October 2026·1178 words·6 mins Server CPUs Agentic AI AI Infrastructure Data Centers Cloud-Computing TrendForce Hyperscalers Semiconductors
Intel 18A Matches TSMC N3E Density, but Is It Ahead? 3 October 2026·1297 words·7 mins Intel 18A Panther Lake Tsmc Semiconductors RibbonFET PowerVia Chiplets Process Technology
Intel Nova Lake-S Leak Reveals 28-Core CPU and BFC Suffix 2 October 2026·1936 words·10 mins Intel Nova Lake Core Ultra Amd Ryzen Z3 Handheld Gaming AI Chips Semiconductors
Intel 14A vs. TSMC A14: Why the <5% Gap Is Conservative 27 September 2026·1781 words·9 mins Intel 14A TSMC A14 Intel Foundry Tsmc Semiconductors Process Nodes Advanced Nodes EUV Lithography
CXL Explained: Protocols, Device Types, Versions, and Memory 22 September 2026·3965 words·19 mins CXL Compute Express Link Memory Data Center AI Infrastructure HBM Ddr5 Memory Pooling Semiconductors
CXMT G5 DRAM Enters Mass Production With 11.95nm Pitch 20 September 2026·1065 words·6 mins CXMT DRAM LPDDR5X Memory Technology Semiconductors China Semiconductor Memory Manufacturing
Loongson 9A1000 GPU Set for 2027 as 9A2000 Targets RTX 2080 13 September 2026·1535 words·8 mins Loongson 9A1000 9A2000 3B6600 LoongArch GPUs CPUs Semiconductors AI Hardware
SK Hynix Targets 20+ Layer HBM5 Stacks With Hybrid Bonding 13 September 2026·1418 words·7 mins SK Hynix HBM HBM5 Hybrid Bonding AI Accelerators Advanced Packaging HBM4 Semiconductors
