AMD ROCm 7.14 Adds Early Support for Ryzen AI MAX PRO 400 17 July 2026·743 words·4 mins AMD ROCm Ryzen Ai Gorgon Halo Ai HPC PyTorch JAX GPU Computing
TSMC and Intel Accelerate Advanced Packaging as Market Tops $8.1 Billion 24 June 2026·1266 words·6 mins TSMC Intel Advanced-Packaging Semiconductor Glass Substrate FOPLP Ai Chips HPC Chiplets Manufacturing
AMD Acquires MEXT to Boost AI Memory Optimization Strategy 16 June 2026·491 words·3 mins AMD AI Infrastructure MEXT Acquisition Memory Optimization Data Center HPC AI Hardware DRAM
LPO vs CPO vs NPO: The Future of AI Optical Interconnects 12 June 2026·1544 words·8 mins AI Infrastructure Optical Networking LPO NPO CPO Silicon Photonics Data Centers HPC Semiconductors Networking
AMD to Invest £2 Billion in UK AI Innovation and Research 8 June 2026·665 words·4 mins AMD Artificial Intelligence United Kingdom Data Center HPC AI Infrastructure Research Epyc Instinct GPU Technology Investment
Linux 7.2 Brings Cache Aware Scheduling for Modern CPUs 23 May 2026·1520 words·8 mins Linux Kernel Scheduler Cache Aware Scheduling Epyc Xeon HPC NUMA Performance Optimization
AMD Instinct vs Nvidia: The Real AI Data Center GPU Gap 23 May 2026·1474 words·7 mins AMD Instinct NVIDIA AI Infrastructure Data Center GPUs ROCm CUDA AI Accelerators HPC
TSMC Maintains Lead Over Intel in Advanced AI Chip Packaging 16 May 2026·530 words·3 mins TSMC Intel Ai Chips Advanced-Packaging CoWoS EMIB-T Semiconductors GPU HPC
AMD Instinct MI430X Targets HPC With 200 TFLOPs FP64 8 May 2026·1008 words·5 mins AMD Instinct MI430X HPC FP64 Supercomputing HBM4 Exascale Computing GPU Architecture Scientific Computing AI Accelerators
AMD MI450 GPU: HBM4, Helios Platform, and AI Strategy 6 May 2026·739 words·4 mins AMD GPU AI Hardware Data Center Machine Learning HPC Semiconductors Infrastructure
